Shinhan Diamond CMP Pad Conditioner

CMP pad conditioners are tools developed to restore the surface of polyurethane pads used in CMP semiconductor fabrication between processes.

Features

• Uniform removal of oxidized layer on a wafer
• Selective removal of some irregularities from uneven surfaces
• Selective removal of irregularities which occur after the process of wire sputtering in interlevel layers, and after the process of interlevel dielectrics
• Uniform removal of different materials such as Oxides, Nitrides, and Al, Cu, W in interlevel dielectrics